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Patent Searching and Data


Title:
HEAT RESISTANT RADIOSENSITIVE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH0643643
Kind Code:
A
Abstract:

PURPOSE: To obtain a composition capable of easily removing an unnecessary part by exposure and development while satisfying various characteristics of a protective film by allowing a base polymer of an alkali aq. solution soluble resin to contain a group originating from carboxylic acid or carboxylic acid anhydride, which is an alkali soluble component, and epoxy group in the same molecule.

CONSTITUTION: This composition contains the alkali aq. solution soluble resin which is a copolymer of an unsaturated carboxylic acid and/or unsaturated carboxylic acid anhydride, a radical polymerizable compound, having epoxy group, and another radical polymerizable compound. Furthermore, a polymerizable compound having at least one ethylenic unsaturated double bond and a photopolymerization initiator are contained. A thermosetting resin is preferably used as the alkali aq. solution soluble resin and the resin is obtained by copolymerizing the unsaturated carboxylic acid and/or unsaturated carboxylic acid anhydride and the radical polymerizable compound having epoxy group with another radical polymerizable compound in a solvent.


Inventors:
SANO KIMIYASU
SHIMADA ATSUFUMI
ENDO MASAYUKI
BESSHO NOBUO
Application Number:
JP19874192A
Publication Date:
February 18, 1994
Filing Date:
July 24, 1992
Export Citation:
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Assignee:
JAPAN SYNTHETIC RUBBER CO LTD
International Classes:
G02F1/1333; G03F7/004; G03F7/027; G03F7/028; G03F7/032; G03F7/033; G03F7/40; (IPC1-7): G03F7/033; G02F1/1333; G03F7/004; G03F7/027; G03F7/028; G03F7/032; G03F7/40
Attorney, Agent or Firm:
Masataka Oshima