To provide a heat-resistant polyamideimide resin composition excellent in adhesiveness, flexibility, and abrasion resistance; a coating material containing the heat-resistant resin composition as a film-forming component; and an enameled wire which is prepared by using the coating material and is excellent in flexibility and abrasion resistance.

This heat-resistant resin composition is prepared by incorporating a heterocyclic mercaptan represented by formula (III) into a polyamideimide resin prepared by reacting a tribasic carboxylic acid derivative having an acid anhydride group, a dicarboxylic acid represented by formula ( I) or (II) or a dicarboxylic acid prepared by hydrogenating the above dicarboxylic acid, and an aromatic polyisocyanate. A coating material containing the resin composition and an enameled wire prepared by using the coating material are also provided.