Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
HEAT-RESISTANT RESIN COMPOSITION FOR MOLDING
Document Type and Number:
Japanese Patent JPS61200149
Kind Code:
A
Abstract:

PURPOSE: The title composition that is obtained by adding a specific amount of a compound active hydrogens to a bismaleimide resin containing fillers, thus showing improved moldability, because its curing time is prolonged and high mechanical strength, as well.

CONSTITUTION: The objective composition is obtained by kneading (A) 100pts.wt. of a bismaleimide resin mainly composed of a compound of the formula (R is a divalent organic group containing alkyl, arylene, group containing 2 phenylene groups bonded with -CH2-, -O-) with, when needed, fillers such as glass fibers, and (B) 0.1W2pts.wt. of a compound bearing active hydrogens, e.g., monocarboxylic acid, such as formic acid, acetic acid, boric acid, organic monoamine such as aniline, monohydric alcohol such as methanol.


Inventors:
FUKUSHIMA MASATADA
SHIRAIWA MASAICHI
MORI RIKIZO
Application Number:
JP4073985A
Publication Date:
September 04, 1986
Filing Date:
February 28, 1985
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SHOWA ELECTRIC WIRE & CABLE CO
RIKEN VINYL IND
International Classes:
C08K5/05; C08K5/17; C08L1/00; C08L27/00; C08L33/00; C08L33/24; C08L35/00; (IPC1-7): C08K5/05; C08K5/17; C08L35/00
Attorney, Agent or Firm:
Suyama Saichi



 
Previous Patent: JPS61200148

Next Patent: THERMOPLASTIC POLYMER COMPOSITION