To provide a heat-resistant polyamideimide resin composition excellent in adhesion and flexibility, a paint comprising the heat-resistant resin composition as a coating film composition, and an enamel wire excellent in adhesion and flexibility using the same.

The heat-resistant resin composition comprises a polyamideimide resin containing a heterocyclic mercaptan of formula (II) [wherein A is a group forming a 5- or 6-membered hetero ring with X and a group of the formula: -N=C(SH)-X-]. The polyamideimide resin is obtained by reacting a mixture comprising (a) a polycarboxylic acid having an acid anhydride group and a valence number of 3, (b) a carbonate diol and (c) an aromatic polyisocyanate.