Title:
HEAT-RESISTANT RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2002179875
Kind Code:
A
Abstract:
To obtain a heat-resistant resin composition having excellent thermal aging resistance and especially suitable as a liquid crystal substrate material, a semiconductor coating material and an adhesive for lens by compounding a cyclic olefin (co)polymer with a combination of specific antioxidants.
The heat-resistant resin composition contains (A) a specific cyclic olefin (co)polymer and (B) at least one kind of antioxidant selected from (b-1) a phenolic antioxidant, (b-2) a phosphorus-based antioxidant and (b-3) a thioether-based antioxidant.
Inventors:
MARUYAMA YOICHIRO
MAKITA MINORU
OSHIMA NOBORU
MAKITA MINORU
OSHIMA NOBORU
Application Number:
JP2000374310A
Publication Date:
June 26, 2002
Filing Date:
December 08, 2000
Export Citation:
Assignee:
JSR CORP
International Classes:
C08L45/00; C08F232/00; C08K5/13; C08K5/37; C08K5/521; C08K5/524; (IPC1-7): C08L45/00; C08K5/13; C08K5/37; C08K5/521; C08K5/524
Domestic Patent References:
| JP2001514798A | 2001-09-11 | |||
| JPH03227331A | 1991-10-08 | |||
| JPH05293159A | 1993-11-09 | |||
| JP2002531648A | 2002-09-24 | |||
| JPH06107735A | 1994-04-19 | |||
| JP2004505129A | 2004-02-19 | |||
| JP2004505308A | 2004-02-19 |
Attorney, Agent or Firm:
Shirai Shigetaka
Previous Patent: JP2002179874
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