Title:
HEAT-RESISTANT RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH0439323
Kind Code:
A
Abstract:
PURPOSE:To provide the title composition high in curing rate at low temperatures, excellent in flexural and solvent resistance, good in adherability, water resistance and low solvent residues, thus suitable for protective coatings, comprising a polyamide-imide resin composition and epoxy resin. CONSTITUTION:The objective composition comprising (A) a polyamide-imide resin obtained by reaction between (1) an aromatic diisocyanate and (2) an aromatic tribasic acid anhydride using as synthesis solvent dimethylformamide in the presence of a 1,8-diazabicyclo(5,4,0)undecene-7 salt of the formula (A is residue of phenol or aliphatic acid) and (B) an epoxy resin. It is preferable that the molar ration of the component 1 to the component 2 be 0.8 - 1.3 and the amount of the component B 10 - 50pts.wt. based on 100pts.wt. of the component A.
Inventors:
OSADA YUICHI
SUZUKI KENJI
OKADA TAISUKE
SUZUKI KENJI
OKADA TAISUKE
Application Number:
JP14468090A
Publication Date:
February 10, 1992
Filing Date:
June 01, 1990
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08G59/18; C08G18/18; C08G18/20; C08G59/00; C08L63/00; C08L79/08; (IPC1-7): C08G18/20; C08G59/18; C08L79/08
Attorney, Agent or Firm:
Kunihiko Wakabayashi
Next Patent: JPH0439324