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Title:
HEAT-RESISTANT RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPS62246961
Kind Code:
A
Abstract:

PURPOSE: To provide the titled compsn which gives moldings having excellent heat resistance, mechanical properties and color tone, by filling a thermoplastic high-molecular resin with specified aluminum hydroxide.

CONSTITUTION: A thermoplastic high-molecular resin (A) such as an unsaturated polyester resin, an acrylic resin, an epoxy resin, PVC, a polyolefin resin, etc. is blended with 10W90wt% gibbsitic Bayer-process aluminum hydroxide (B) having an average particle size of 0.5W15μ, an N2 gas adsorption surface area of not lower than 2.8m2/g, a total Na2O content of not higher than 0.08wt% and a whiteness degree of 97 or higher, whose surface is optionally treated with a silane coupling agent to such an extent that the content of said silane coupling agent is 0.5W2wt%.


Inventors:
ODA YUKIO
KITAYAMA MIKITO
Application Number:
JP3527086A
Publication Date:
October 28, 1987
Filing Date:
February 21, 1986
Export Citation:
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Assignee:
SHOWA DENKO KK
International Classes:
C08K3/22; C08K9/06; C08L1/00; C08L7/00; C08L21/00; C08L23/00; C08L27/00; C08L33/00; C08L33/02; C08L67/00; C08L101/00; (IPC1-7): C08K3/22; C08K9/06; C08L101/00
Domestic Patent References:
JPS59204632A1984-11-20
Attorney, Agent or Firm:
Minoru Terada



 
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