Title:
HEAT-RESISTANT RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPS6357641
Kind Code:
A
Abstract:
PURPOSE: To obtain a heat-resistant resin compsn. which gives a flat coated surface when applied to a substrate having unevenness and does not cause brekage during curing by heating, by using a specified silicone resin as a component.
CONSTITUTION: A resin compsn. represented by the formula (wherein n is 1W100; and R is methyl or ethyl). Since it has a low weight-average MW, it has a good leveling effect. Since it is not broken at 480°C or lower, it does not cause breakage during a heating stage such as a curing stage. Thus, the compsn. is suitable for use as an interlaminar insulating film for semiconductor integrated circuits.
Inventors:
FUKUYAMA SHUNICHI
SHIBA SHOJI
SAITO KAZUMASA
KAWASAKI YOKO
YONEDA YASUHIRO
SHIBA SHOJI
SAITO KAZUMASA
KAWASAKI YOKO
YONEDA YASUHIRO
Application Number:
JP20433286A
Publication Date:
March 12, 1988
Filing Date:
August 29, 1986
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
C07F7/18; C07F7/08; C08G77/16; C08G77/22; (IPC1-7): C07F7/08; C08G77/16
Attorney, Agent or Firm:
Sadaichi Igita