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Title:
HEAT-RESISTANT RESIN MOLDING MATERIAL
Document Type and Number:
Japanese Patent JPS5614553
Kind Code:
A
Abstract:

PURPOSE: To provide the titled molding material with excellent electric properties, chemical resistance, impact resistance and heat resistance using a resin obtained by reacting a reaction product of a diamine and a specific dicarboxylic acid anhydride with a multifunctional carboxylic acid compound.

CONSTITUTION: To 100pts.wt, of (A) a reaction product with m.p. of 150°C or less obtained by reacting 1mol of (a) a diamine (reactive derivative) such as m-phenylenediamine and 0.05W0.6mol of (b) a dicarboxylic acid anhydride having an ethylenic C-C double bond such as maleic anhydride under a molten condition at 90W200°C for 10W60min, 10W60pts.wt. of (B) a multifunctional carboxylic acid compound such as terephthalic acid is compounded and kneaded at 50W120°C for 5W30min to obtain a resin (C). Subsequently, to 100pts.wt. of this resin (C), 5W 20pts.wt. of novolac resin (D) and a curing accelerator are added and the obtained mixture is kneaded at room temp.W120°C to obtain the titled molding material.


Inventors:
NISHIKAWA AKIO
SUZUKI HIROSHI
Application Number:
JP8820779A
Publication Date:
February 12, 1981
Filing Date:
July 13, 1979
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
C08G73/00; C08G69/26; C08G73/10; C08L77/06; C09J179/08; (IPC1-7): C08G69/26; C08L77/06; C09J3/16



 
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