Title:
HEAT-RESISTANT STYRENIC RESIN COMPOSITION, EXTRUDED SHEET, MOLDED PRODUCT
Document Type and Number:
Japanese Patent JP2020105403
Kind Code:
A
Abstract:
To provide a heat-resistant styrenic resin composition that has excellent various characteristics such as heat-resistance, mechanical strength, extrusion moldability, and deep drawability during vacuum molding, and can obtain a molded product having sufficiently excellent appearance by suppressing mold contamination.SOLUTION: A heat-resistant styrenic resin composition of the present invention contains a copolymer resin (a) that is a styrene-methacrylic acid copolymer, a MBS resin (b), and a styrenic resin (c) having a weight average molecular weight of 200,000 to 2,000,000, in which a content of the (a) component is 83 to 99 mass%, a content of the (b) component is 0.9 to 12 mass%, a content of the (c) component is 0.1 to 5.0 mass%, the (a) component contains 84 to 96 mass% of a styrene monomer unit and 4 to 16 mass% of a methacrylic acid monomer unit, a Vicat softening temperature is 106°C or higher, a degree of branching is 0.60 to 0.95, and a degree of gelation is 1.10 to 1.60.SELECTED DRAWING: None
Inventors:
NAKAGAWA MASARU
Application Number:
JP2018246183A
Publication Date:
July 09, 2020
Filing Date:
December 27, 2018
Export Citation:
Assignee:
PS JAPAN CORP
International Classes:
C08L25/08; C08J5/18; C08J9/04; C08K5/05; C08L25/04; C08L51/04
Domestic Patent References:
| JP2018090753A | 2018-06-14 | |||
| JP2018009111A | 2018-01-18 | |||
| JPH10330425A | 1998-12-15 |
Attorney, Agent or Firm:
Kenji Sugimura
Mitsutsugu Sugimura
Koichiro God
Hirota Taura
Mitsutsugu Sugimura
Koichiro God
Hirota Taura