To provide a heat-resistant temperature-sensitive pressure-sensitive adhesive which has high heat-resistance and which is easily removable.

The heat-resistant temperature-sensitive pressure-sensitive adhesive is a temperature-sensitive pressure-sensitive adhesive which contains a side-chain crystalline polymer and whose pressure-sensitive adhesive power is lowered at a temperature lower than the melting point of the side-chain crystalline polymer, wherein the side-chain crystalline polymer is obtained by polymerizing at least two monomers respectively having functional groups reacting with each other at a surrounding temperature of 130°C or higher and another monomer constituting the side-chain crystalline polymer, and the heat-resistant temperature-sensitive pressure-sensitive adhesive is a copolymer with a weight average molecular weight of 200,000-1,000,000.