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Patent Searching and Data


Title:
HEAT-RESISTANT THERMAL ADHESIVE FILM
Document Type and Number:
Japanese Patent JPH081877
Kind Code:
A
Abstract:

PURPOSE: To obtain a high performance thermal adhesive film excellent in bonding strength and heat resistance by laminating a thin layer of a blend consisting of an ethylene/ethyl acrylate/maleic anhydride terpolymer and an ethylene/methyl methacrylate copolymer to both surfaces of a base material.

CONSTITUTION: As a polypropylene film being a base material, a film composed of a propylene homopolymer is most proper if heat resistance is considered to be important. As an ethylene/ethyl acrylate/maleic anhydride terpolymer, one consisting of ethylene 68-95 wt.%, ethyl acrylate 1.0-30wt.% and maleic anhydride 0.5-4wt.% is proper. As an ethylene/methyl methacrylate copolymer to be blended, one with copolymerization ratio (wt. ratio) of ethylene and methyl methacrylate of 90:10-85:25 is proper.


Inventors:
NOYA KAZUO
TAKAGI YAZO
OMATA YUJI
Application Number:
JP15960594A
Publication Date:
January 09, 1996
Filing Date:
June 20, 1994
Export Citation:
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Assignee:
SUN A CHEMICAL IND
International Classes:
B32B27/08; B32B27/28; B32B27/32; C08L23/00; C08L23/08; (IPC1-7): B32B27/28; B32B27/08; B32B27/32
Attorney, Agent or Firm:
Isao Itai