PURPOSE: A thermosetting, electrically conductive adhesive with excellent heat resistance and high-temp. adhesion, useful for bonding an IC chip to an electrode, a semiconductor heating element to a metal sheet, etc. which is prep. by mixing a liquid epoxy resin, a polyimide resin powder and an electrically conductive metal powder.
CONSTITUTION: A liquid epoxy resin (A) pref. having viscosity ≤500cps at room temp., a polyimide resin powder (B) pref. having particle size ≤100μ, and an electricaly conductive metal powder (C) pref. of a particle size ≤30μ are mixed to obtain the titled electrically conductive adhesive. It is pref. for the component C to account for 70W90wt% of the total component. It is possible to cure said adhesive for examle, by keeping it at 150°C for 3hr.
EFFECT: Simply applicable in the absence of any solvents.
KONDOU KENJI
ONODA MASATOSHI
