Title:
熱シール接着剤組成物
Document Type and Number:
Japanese Patent JP4511660
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a heat-sealable adhesive composition which, when applied to a substrate such as a plastic film, a metal foil, paper, or a nonwoven fabric, can form a heat-sealable adhesive layer excellent in heat sealability, printability, and oil resistance. SOLUTION: This adhesive composition contains an emulsion formed by dispersing resin particles at least comprising resin particles (I) and resin particles (II) in water. Resin particles (I) contain an olefin polymer (A) having structural units derived from an olefin monomer (a-1); and resin particles (II) contain an acrylic polymer (B) having structural units derived from an acrylic monomer (b).
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Inventors:
Keiichi Taki
Tadashi Saito
Makoto Nakano
Ishida Tadashi
Tadashi Hoshino
Tadashi Saito
Makoto Nakano
Ishida Tadashi
Tadashi Hoshino
Application Number:
JP36688099A
Publication Date:
July 28, 2010
Filing Date:
December 24, 1999
Export Citation:
Assignee:
Mitsui Chemicals, Inc.
International Classes:
C08J7/04; C09J123/08; C08F210/00; C09J7/02; C09J133/08; C09J133/10
Domestic Patent References:
| JP11091826A | ||||
| JP61019678A | ||||
| JP1085269A | ||||
| JP10273570A |
Attorney, Agent or Firm:
Akio Miyazaki
Masaaki Ogata
Nobuyuki Kaneda
Katsuhiro Ito
Ishibashi Masayuki
Masaaki Ogata
Nobuyuki Kaneda
Katsuhiro Ito
Ishibashi Masayuki