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Title:
HEAT-SEALABLE LAMINATED POLYPROPYLENE RESIN FILM AND PACKAGE
Document Type and Number:
Japanese Patent JP2006305884
Kind Code:
A
Abstract:

To provide a heat-sealable laminated polypropylene resin film having heat-sealing strength and sealability enough to package a heavy load and a package obtained by using the film.

The oriented polypropylene resin film is obtained from a laminate having at least three layers of a substrate layer which is obtained from a crystalline polypropylene resin and a propylene-α-olefin copolymer and has a melting point of 155°C or below, an intermediate layer, and a heat fusion layer of a melting point of 150°C or below. In the heat-sealable laminated polypropylene resin film, at least 5 wt.% of a resin used in the heat fusion layer is incorporated.


Inventors:
KAWAI KENJI
OKI SUKEKAZU
Application Number:
JP2005131759A
Publication Date:
November 09, 2006
Filing Date:
April 28, 2005
Export Citation:
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Assignee:
TOYO BOSEKI
International Classes:
B32B27/32; B65D65/40