Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
HEAT SEALING ADHESIVE AND HEAT SEAL NATURE LID MATERIAL
Document Type and Number:
Japanese Patent JP2012001576
Kind Code:
A
Abstract:

To provide a heat sealing adhesive in which influence of heat seal temperature to heat seal nature adhesive strength is small, and a heat seal nature lid material using the same.

The heat seal nature lid material 12 includes a substrate 16, a design layer 16 prepared on the surface, and a heat seal nature resin layer 18 prepared on the back surface. The heat seal nature resin layer 18 is formed as follows. The heat sealing adhesive in which silica is distributed in a liquid composition in which a carboxylic acid modified propylene (co)polymer is dissolved or dispersed in a solvent is coated on the substrate 16 and is dried.


Inventors:
IWATA YOSHIKAZU
Application Number:
JP2010135512A
Publication Date:
January 05, 2012
Filing Date:
June 14, 2010
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
LEADER CO LTD
International Classes:
C09J123/26; B65D77/20; B65D83/04; C09J7/02; C09J11/04; C09J123/14
Domestic Patent References:
JP2006307104A2006-11-09
JP2009126924A2009-06-11
JPS5936655B21984-09-05
JPS6026031B21985-06-21
Attorney, Agent or Firm:
Shigeo Akiyama
Masamoto Kamata