Title:
HEAT SEALING LACQUER COMPOSITION
Document Type and Number:
Japanese Patent JP2003226836
Kind Code:
A
Abstract:
To obtain a heat sealing lacquer composition containing a chlorine atom-free resin as a component, having performance equivalent to that of a composition using a vinyl chloride-vinyl acetate copolymer, and which composition can become an alternative thereto.
This heat sealing lacquer composition comprises a styrene-based block copolymer such as an organic acid group-bearing SEBS, a vinyl polymer such as an acrylic polymer or a polystyrene and/or a filler such as talc.
Inventors:
YAMASHITA SHINICHI
MASHITA YUKIFUMI
MASHITA YUKIFUMI
Application Number:
JP2002030745A
Publication Date:
August 15, 2003
Filing Date:
February 07, 2002
Export Citation:
Assignee:
TOYO MOOTON KK
International Classes:
C09D153/02; C09D125/00; C09D133/00; C09D151/04; C09D157/00; (IPC1-7): C09D153/02; C09D125/00; C09D133/00; C09D151/04; C09D157/00
Attorney, Agent or Firm:
Hidekazu Miyoshi (7 outside)
Previous Patent: SMOOTHING AGENT FOR NONAQUEOUS COATING MATERIAL
Next Patent: SURFACE TREATMENT AGENT
Next Patent: SURFACE TREATMENT AGENT