HEAT-SENSITIVE COMPOSITION - MITSUBISHI CHEM CORP

Title:

HEAT-SENSITIVE COMPOSITION

Document Type and Number:

Japanese Patent JPH08283319

Kind Code:

A

Abstract:

PURPOSE: To obtain a heat-sensitive compsn. capable of thermally forming a fine resist pattern by compounding a vinyloxy compd. with an acidic or hydroxyl compd. capable of thermally cross-linking with vinyloxy groups.

CONSTITUTION: This compsn. comprises a compd. having at least two vinyloxy groups and a compd. having acidic or hydroxyl groups capable of thermally cross-linking with vinyloxy groups. A compd. having at least two vinyloxy groups and acidic or hydroxyl groups thermally cross-linking with vinyloxy groups is pref. The compsn. contg. a colorant which efficiently absorbs laser light and converts it into heat is still pref.

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Inventors:

URANO TOSHIYOSHI
YAMAOKA TSUGIO
NAGASAKA HIDEKI

Application Number:

JP11409095A

Publication Date:

October 29, 1996

Filing Date:

April 17, 1995

Export Citation:

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Assignee:

MITSUBISHI CHEM CORP

International Classes:

G03F7/004; B41M5/26; C08F2/00; C08F2/44; C08F2/50; G03F7/00; G03F7/027; G03F7/038; G03F7/20; H01L21/027; H05K3/06; (IPC1-7): C08F2/50; B41M5/26; C08F2/44; G03F7/00; G03F7/004; G03F7/027; G03F7/038; G03F7/20; H01L21/027

Attorney, Agent or Firm:

Hasegawa Hajime (2 outside)

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