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Patent Searching and Data


Title:
HEAT SENSITIVE FLOW RATE SENSOR
Document Type and Number:
Japanese Patent JP2012112737
Kind Code:
A
Abstract:

To provide a manufacturing method of a heat sensitive rate flow sensor which can suppress the contact of a tip end of a part formed in a storage recessed portion suppressing the excessive swivel of detected fluid in a recessed portion, with a sensor tip.

A sensor chip 10; and a mounting member 20 formed with a storage recessed portion 21 mounting a sensor chip 10 on one surface 20a, and formed with a through-hole 23 on a bottom surface of the storage recessed portion 21 are prepared. Then, the recessed portion 12 and the through-hole 23 are opposed, and a part of the sensor chip 10 is mounted on the bottom surface of the storage recessed portion 21 through a connecting member 70. Resin is injected from the through-hole 23, and a protrusion portion 22 extending from the bottom surface of the storage recessed portion 21 in a direction of the sensor chip 10, disposed in the recessed portion 12, and separated from the sensor chip 10 is formed.


Inventors:
ITO KEIYA
MUTO KOJI
Application Number:
JP2010260699A
Publication Date:
June 14, 2012
Filing Date:
November 23, 2010
Export Citation:
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Assignee:
DENSO CORP
International Classes:
G01F1/684
Domestic Patent References:
JP2010151542A2010-07-08
Foreign References:
DE102010028387A12010-11-04
WO2003063258A12003-07-31
Attorney, Agent or Firm:
Patent Business Corporation Yuai Patent Office