Title:
HEAT SENSITIVE WIRE, AND NON-CONTACT POWER FEEDING DEVICE EQUIPPED WITH THE HEAT SENSITIVE WIRE
Document Type and Number:
Japanese Patent JP2009004123
Kind Code:
A
Abstract:
To provide a heat sensitive wire capable of reducing influence of magnetic field generated by magnetizing current of a non-contact power feeding device by using a heat sensitive wire with the inductance made minimum, and reducing cost of the heat sensitive wire, and to provide a non-contact power feeding device equipped with the heat sensitive wire.
The non-contact power feeding device is provided with a heat sensitive wire 4 with wires mutually insulated by a melting layer 3 melting at a predetermined temperature. The heat sensitive wire 4 has a coaxial structure with an inner side wire 5 and an outer side wire 6, and is spirally wound so as each spiral direction of the inner side wire 5 and the outer side wire 6 to be opposite direction.
Inventors:
Yamamoto, Harumasa
Application Number:
JP2007000161635
Publication Date:
January 08, 2009
Filing Date:
June 19, 2007
Export Citation:
Assignee:
HITACHI PLANT TECHNOLOGIES LTD
International Classes:
H01H37/76; B60M7/00; H02H3/00; H02H5/04; H02J17/00; H01F38/14
