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Patent Searching and Data


Title:
HEAT-SHRINKABLE FILM
Document Type and Number:
Japanese Patent JP2001310386
Kind Code:
A
Abstract:

To provide a heat-shrinkable polyamide film excellent in gas-barrier properties, transparency, and lamination strength.

In the heat-shrinkable film, 0.1-5 mass pts. of a modified polyolefin is added to 100 mass pts. of a polyamide comprising 55-85 mass % of an aliphatic polyamide and 15-45 mass % of a xylylene-containing polyamide. The modified polyolefin is a copolymer containing 95-50 mass % of an ethylene unit, 0.1-10 mass % of the unit of an unsaturated dicarboxylic acid and/or its derivative, and 4.9-40 mass % of the unit of an unsaturated monocaroxylic acid and/or its lower alkyl ester derivative.


Inventors:
INAGAKI MADOKA
TACHIKAWA ATSUSHI
Application Number:
JP2000130167A
Publication Date:
November 06, 2001
Filing Date:
April 28, 2000
Export Citation:
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Assignee:
UNITIKA LTD
International Classes:
C08J5/18; B29C61/06; C08L77/06; (IPC1-7): B29C61/06; C08J5/18; C08L77/06