Title:
包装に有用な熱収縮性積層体
Document Type and Number:
Japanese Patent JP2004538189
Kind Code:
A
Abstract:
A heat shrinkable film laminate contains (a) a heatable shrinkable film, (b) a solventless adhesive and (c) a film having a heat shrinkage of at least 5% less than the heat shrinkable film (a). Preferably the laminate also contains (d) a barrier layer adjacent (a).
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Inventors:
Terence Dee. Kendig
Application Number:
JP2003520585A
Publication Date:
December 24, 2004
Filing Date:
August 21, 2002
Export Citation:
Assignee:
E.I.DU PONT DE NEMOURS AND COMPANY
International Classes:
B65D65/40; B32B7/12; B32B27/08; B32B27/36; B65B7/28; B65D77/20; C08J7/043; C08J7/048; C08J7/054; (IPC1-7): B32B27/36; B65D65/40
Attorney, Agent or Firm:
Yoshikazu Tani
Kazuo Abe
Kazuo Abe