To provide a heat sink equipped with a multi-hole type heat pipe having excellent cooling characteristic, and to provide the mounting structure thereof.
In this heat sink, the multi-hole type heat pipe 4 formed by sealing the operating fluid in an extruded multi-hole pipes, while reducing the pressure thereof, is thermally fastened to a base plate 2, and the base plate 2 is provided with a heater fitting hole 5. A communication member 8 for communicating each hole 3 with each other is provided on an opening end 7 side of the extruded multi-hole pipe 1. The heater is fastened to the base plate of the heat sink by bolts to provide the heat sink mounting structure. Or, the heater is fastened to the base plate 2 of the heat sink by bolts and, furthermore, fins are thermally fastened to provide the heat sink mounting structure.
JP2000130971 | CARBON FIBER SKIN HEAT PIPE PANEL |
JPH04222705 | HEAT TRANSFER DEVICE |
WO/2001/088456 | EVAPORATOR EMPLOYING A LIQUID SUPERHEAT TOLERANT WICK |
SHIMURA TAKAHIRO
SHIYOU HITOSHI
Next Patent: ICE MAKER, REFRIGERATOR, AND ICE MAKING METHOD FOR REFRIGERATOR