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Title:
Heat-stabilized polyamide composition
Document Type and Number:
Japanese Patent JP6304481
Kind Code:
B2
Abstract:
Heat stabilized polyamide composition, characterized in that the composition contains polyamide 410 (PA-410) and a copper compound and reinforcement fibers. PA-410 is a polyamide containing monomer units derived from a dicarboxylic acid with a chain of 10 carbon atoms between the carboxylic acid groups and a diamine with 4 carbon atoms. Preferably as the dicarboxylic acid 1,10 decandioic acid is used. As the diamine preferably 1,4-butanediane is used.

Inventors:
Richhard, Ronald
Heissmann, Peter
Application Number:
JP2013533242A
Publication Date:
April 04, 2018
Filing Date:
October 17, 2011
Export Citation:
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Assignee:
DSM IP ASSETS B.V.
International Classes:
C08L77/06; C08K3/16; C08K7/02
Domestic Patent References:
JP201194103A
JP2007112915A
Foreign References:
WO2010098335A1
Attorney, Agent or Firm:
Ikeda adult
Kazuhiro Yamaguchi
Masakazu Noda
Yoshinori Shimizu
Junichiro Sakamaki
Hiroshi Abe