To provide a heat transfer applique material produced by using a woven fabric, a knitted fabric or a nonwoven fabric as an applique ground, a heat transfer applique material free from generation of fray from a contour edge of the applique, and a heat-transfer applique.

An interposed layer 3 composed of a thermoplastic synthetic resin having a melting point higher than a sublimation temperature is formed on the back 2 of a cloth composed of a sublimable transfer material, a hot-melt transfer adhesive layer 4 is formed on the back 3 of the interposed layer, the transfer adhesive layer 4 is lined with a release sheet and cut out to a desired shape, and the obtained heat transfer applique material is thinned along the contour of the desired shape to obtain the heat transfer applique material. Short fibers are transferred at least along the contour of the cloth surface of the heat transfer applique material by using a flocked transfer sheet having a short fiber pattern transfer layer composed of a short fiber pattern bonded film 14 to transfer a desired pattern and a short fiber pattern transfer film 15 to obtain the heat transfer applique material. There is also provided the heat transfer applique.