Title:
HEAT TRANSFER INTERFACE
Document Type and Number:
Japanese Patent JP2016166735
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a heat transfer interface.SOLUTION: An object of an embodiment of the present invention is to provide a system and method for a thermal management system at temperatures within a range of 120-1,300°C. The present system consists of a variety of thermal transfer chambers configured to include a thermal transfer device which is in a spherical or cylindrical shape or other shapes, and absorbs heat within a wide temperature range and returns such heat of certain temperature for an extended period. The thermal management system includes a plurality of heat transfer particles, which each consist of an inside heat transfer medium charged in an outer container, the outer container being inactive to a heat source and enabling fast acquisition of heat of temperature within the range of 120-1,300°C from the heat source and subsequent dissipation of heat of certain temperature for a certain time.SELECTED DRAWING: Figure 8
Inventors:
EUGENE THIERS
Application Number:
JP2016104883A
Publication Date:
September 15, 2016
Filing Date:
May 26, 2016
Export Citation:
Assignee:
SYLVAN SOURCE INC
International Classes:
F27D17/00; F28D20/00; F28D20/02; F28F21/04; F28F21/06; F28F21/08
Attorney, Agent or Firm:
Hidesaku Yamamoto
Natsuki Morishita
Takatoshi Iida
Daisuke Ishikawa
Kensaku Yamamoto
Natsuki Morishita
Takatoshi Iida
Daisuke Ishikawa
Kensaku Yamamoto