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Patent Searching and Data


Title:
HEAT TRANSFER PIPE FOR FLOWING-DOWN FLUID FILM TYPE EVAPORATOR
Document Type and Number:
Japanese Patent JPH10176890
Kind Code:
A
Abstract:

To increase a substantial heat transfer area and hence improve heat transfer performance by suppressing occurrence of drying-out without increasing the amount of supply of a liquid refrigerant.

The present heat transfer pipe 10 is adapted such that many fins 12 are formed on an outer peripheral surface of a pipe body 11 so as to perpendicularly intersect a pipe axis, and a plurality of grooves 13 are formed in the many fins 12 so as to extend in the direction of the pipe axis. The fin 12 is formed into a fin height H of 0.3 to 1.5mm and a fin pitch Pf of 0.4 to 1.5mm, and the groove 13 is formed into a groove depth D of 0.5 to 2.0mm and a groove interval Pg of 0.3 to 4.0mm. By mounting the many fins 12 on the pipe outer peripheral surface a heat transfer area is increased, and wetting is improved. By providing the plurality of the grooves 13 in the many fins 12 so as to extend in the direction of the pipe axis liquid dispsersion effect in the direction of the pipe axis is increased, and liquid film thickness is made uniform to prevent drying-out from happening and increase the substantial heat transfer area. As a result, heat transfer performance is improved.


Inventors:
NAKAI TAKESHI
TOBE MASAKAZU
KAWAMATA OSAMU
SATO TAKASHI
Application Number:
JP33365096A
Publication Date:
June 30, 1998
Filing Date:
December 13, 1996
Export Citation:
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Assignee:
HITACHI CABLE
International Classes:
F28F13/02; F25B39/02; F28D5/02; (IPC1-7): F28D5/02; F25B39/02; F28F13/02
Attorney, Agent or Firm:
Tadao Hirata