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Patent Searching and Data


Title:
HEAT TRANSFER TAPE
Document Type and Number:
Japanese Patent JP57155277
Kind Code:
A
Abstract:

PURPOSE: The titled tape, prepared by continuously placing a specific thin layer of a pressure-sensitive adhesive on an area in contact with a radiator on one side of a flexible heat transfer support, and continuously placing a pressure- sensitive adhesive layer of specific thickness on other areas alternately, and having improved heat conductivity and supporting force for the heat radiation.

CONSTITUTION: A pressure-sensitive adhesive layer (4A) having a thickness ≤0.01mm, preferably 1W3μ, is continuously placed on an area (3A) in contact with a member, e.g. a refrigerant flow pipe 20, requiring the heat radiation on one side of a flexible support 1, e.g. aluminum or copper foil, having the heat conductivity, and a pressure-sensitive adhesive layer (4B) having a thickness ≥0.02mm is continuously placed alternately on other areas to give the aimed tape (A). A composite film of a plastic with a metallic film may be used as the support 1. An acrylic ester polymer or silicone rubber is preferred as the pressure-sensitive adhesive.


Inventors:
Konishi, Toshiharu
Shimizu, Yukio
Application Number:
JP1981000041228
Publication Date:
September 25, 1982
Filing Date:
March 19, 1981
Export Citation:
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Assignee:
NITTO ELECTRIC IND CO LTD
International Classes:
C09J7/02; F25B39/02; F28F1/20; F28F3/12; H01L23/373; (IPC1-7): C09J7/02; F25B39/02; F28F3/12