Title:
HEAT CONDUCTION UNIT AND COOLING DEVICE
Document Type and Number:
Japanese Patent JP2023123891
Kind Code:
A
Abstract:
To provide a heat conduction unit which can inhibit a heat conduction member from thermally expanding and causing warpage, and to provide a cooling device including the heat conduction unit.SOLUTION: A heat conduction unit 1 includes: a heat conduction member 10 having an internal space S in which a working medium 2 is housed; and a support member 20 supporting the heat conduction member 10. The heat conduction member 10 has: a body area 10M; an outer periphery area 10C located along an outer periphery of the body area 10M when viewed in a thickness direction of the heat conduction member 10; and pillar parts arranged in the internal space S. The support member 20 supports at least a part of the outer periphery area 10C.SELECTED DRAWING: Figure 3
Inventors:
ISHIDA JUNICHI
KOSEKI TOSHIHIKO
HANANO MASAAKI
TAKAO MASASHI
YANG SHI YU
KOSEKI TOSHIHIKO
HANANO MASAAKI
TAKAO MASASHI
YANG SHI YU
Application Number:
JP2021088006A
Publication Date:
September 06, 2023
Filing Date:
May 25, 2021
Export Citation:
Assignee:
NIDEC CORP
CHAUN CHOUNG TECH NOLOGYCORP
CHAUN CHOUNG TECH NOLOGYCORP
International Classes:
F28D15/02; H05K7/20
Attorney, Agent or Firm:
Patent Attorney Corporation Sano Patent Office