Title:
HEAT TRANSFERRING DEVICE
Document Type and Number:
Japanese Patent JP3731601
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To transfer effectively heat generated in heated components to the case wall of a radiating portion without being influenced by an arrangement of components, even in an electronic apparatus wherein heated electronic components are packed in a narrow space together with other components.
SOLUTION: The electronic apparatus includes a heat receiving portion 14 which transfers the heat of the electronic components 1 to be cooled through an inside liquid flow route, a radiating portion 16 having a liquid flow route inside, and a liquid driving device 40 arranged in a circulating route 18 connecting the heat receiving portion 14 and the radiating portion 16. The radiating portion 16 and the liquid driving device 40 are mounted on the predetermined position on a base, and the heat receiving portion 14 is connected to the outside of the base through the circulating route 18.
Inventors:
Shigeo Ohashi
Toshio Hatada
Shinji Tanaka
Toshio Hatada
Shinji Tanaka
Application Number:
JP2004253350A
Publication Date:
January 05, 2006
Filing Date:
August 31, 2004
Export Citation:
Assignee:
株式会社日立製作所
International Classes:
F25D9/00; H05K7/20; G06F1/20; (IPC1-7): H05K7/20; F25D9/00; G06F1/20
Domestic Patent References:
| JP5021975A | ||||
| JP4133497A | ||||
| JP488517A | ||||
| JP5264139A |
Attorney, Agent or Firm:
Yasuo Sakuta