Title:
HEAT-TREATING APPARATUS
Document Type and Number:
Japanese Patent JPH0917742
Kind Code:
A
Abstract:
PURPOSE: To improve the uniformity of the surface temperature of a material to be treated during heat-treating of an optical heat-treating apparatus.
CONSTITUTION: A lamp annealing apparatus 1 heats a semiconductor wafer 6 contained in a chamber 2 in the state supported by a support pin 7b by lamps 10 disposed at an interval vertically above and below the wafer 6, and has point-like lamps 11 for heating by emitting a light to the area in contact with the pin 7b at the wafer 6.
Inventors:
NAKATSUKA YASUHIKO
NAKAMURA SHUICHI
KUREISHI YOSHINORI
SUZUKI TADASHI
NAGAYAMA TOMOJI
NAKAMURA SHUICHI
KUREISHI YOSHINORI
SUZUKI TADASHI
NAGAYAMA TOMOJI
Application Number:
JP16439395A
Publication Date:
January 17, 1997
Filing Date:
June 30, 1995
Export Citation:
Assignee:
HITACHI LTD
HITACHI VLSI ENG
HITACHI VLSI ENG
International Classes:
H01L21/683; H01L21/22; H01L21/26; H01L21/31; H01L21/324; H01L21/68; (IPC1-7): H01L21/26; H01L21/22; H01L21/31; H01L21/324; H01L21/68
Attorney, Agent or Firm:
Yamato Tsutsui
Next Patent: MANUFACTURE OF SEMICONDUCTOR DEVICE