To provide a heat treating method for a resist-coated substrate such that it is not complicated to maintain and manage a device and temperature control is easy, the heat treating method for the resist-coated substrate being characterized in that a temperature distribution of a heat plate heated by a heat source has no abrupt temperature variation and an in-surface temperature distribution of a PEB is optionally varied; and a heat treating device therefor.

Disclosed is the heat treating method using the heat treating device for the resist-coated substrate, the heat treating method being characterized in mounting the resist-coated substrate on one top plane plate having heat conductivity, moving up or down a heated portion divided into a center part and an edge part outside it by an elevation mechanism to increase or decrease the gap between the top plate and the respective heated parts, and thus varying the temperature distribution in the surface of the top plate to heat the resist-coated substrate.