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Patent Searching and Data


Title:
HEAT-TREATING DEVICE FOR SUBSTRATE
Document Type and Number:
Japanese Patent JP2790390
Kind Code:
B2
Abstract:

PURPOSE: To improve treating capabilities per unit time by cooling compulsively a furnace core tube through flowing gas for cooling between the furnace core tune and a heating system in a condition of blocked influence caused by remaining heat from the heating system due to an interrupting cylinder after heat treatment.
CONSTITUTION: In a condition where an interrupting cylinder 13 is positioned at a non-heat interruption place, a heater unit 6 is electrically energized, and prescribed heat treatment is made for a substrate W. After completing heat treatment on the substrate W, cooling water is supplied in a condition where the interrupting cylinder is elevated to a heat interruption place, and the interrupting cylinder 13 is cooled. While at the same time, outside air is made to flow as cooling gas between the outside of a furnace core tube 1 and the inside of the heater unit 6, through cooling as supplying means. Therefore, while interrupting the influence due to remaining heat from the heater unit 6, a furnace core tube 1 can be cooled. As a result, treatment capability per unit time can be improved.


Inventors:
KUROIWA TOORU
MURAOKA JUSUKE
Application Number:
JP4223592A
Publication Date:
August 27, 1998
Filing Date:
January 30, 1992
Export Citation:
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Assignee:
DAINIPPON SUKURIIN SEIZO KK
International Classes:
F27B5/06; F27B17/00; F27D9/00; H01L21/22; H01L21/31; (IPC1-7): H01L21/31; F27B5/06; F27B17/00; F27D9/00; H01L21/22
Domestic Patent References:
JP3185818A
JP2138728A
Attorney, Agent or Firm:
Tsutomu Sugitani