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Title:
HEAT-TREATING DEVICE
Document Type and Number:
Japanese Patent JP3715073
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a heat-treating device which can effectively prevent the positional deviation of a substrate, when the substrate is elevated and lowered while the substrate is supported by supporting pins.
SOLUTION: A heat-treating device is provided with a heat-treating section 2 having a heating plate 12 and a cooling section 3 having a cooling plate 22 in a housing 4. Each of the heating and the cooling plates 12, 22 has three through holes 13, and three supporting pins 14 are provided so that the pins 14 may be elevated and lowered through the holes 13. The pins 14 are erected on a supporting arm 15 coupled with an air cylinder 16 at the positions oppositely faced to the peripheral edge of the backside of a substrate W supported on the pins 14.


Inventors:
Kawamoto, Takanori
Otani, Masami
Imanishi, Yasuo
Tsuji, Masao
Iwami, Masaki
Morita, Akihiko
Nishimura, Joichi
Application Number:
JP1997000120174
Publication Date:
November 09, 2005
Filing Date:
April 22, 1997
Export Citation:
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Assignee:
DAINIPPON SCREEN MFG CO LTD
International Classes:
H01L21/683; F27D5/00; H01L21/027; H01L21/68; (IPC1-7): H01L21/027; H01L21/68
Domestic Patent References:
JP8124818A
JP3035011A
JP8222503A
JP5047652A
JP4181717A
JP5304071A
Attorney, Agent or Firm:
大坪 隆司