Title:
Heat treating method
Document Type and Number:
Japanese Patent JP6103279
Kind Code:
B2
More Like This:
JP2011220555 | HEAT TREATMENT FURNACE |
JP2023024000 | HEAT TREATMENT DEVICE |
JPH0573496 | [Name of device] Solder reflow device |
Inventors:
Masato Abe
Application Number:
JP2015536487A
Publication Date:
March 29, 2017
Filing Date:
July 30, 2014
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
F27D7/06; B22F3/10; C04B35/638; F27D17/00; H01G4/12; H01G4/30
Domestic Patent References:
JP11080808A | ||||
JP10274486A | ||||
JP2004123524A | ||||
JP2004198038A |
Attorney, Agent or Firm:
Sakai Masatoshi