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Title:
HEAT TREATMENT APPARATUS AND HEAT TREATMENT METHOD
Document Type and Number:
Japanese Patent JP2005150699
Kind Code:
A
Abstract:

To provide a heat treatment apparatus and a heat treatment method capable of improving a product yield by contriving the equalization of the inplane temperature distribution of an object to be treated.

The heat treatment apparatus comprises: a mount 22 mounting a plate-like object to be treated and having a heating element heating it to a predetermined temperature; a supporting member 23 moving relatively to the mount in such a manner as to mount or separate the object to be treated on or from the mount; a cover 28 surrounding the upper side of the mount 22; and a casing 25 surrounding the lower side of the mount 22 and forming a treatment chamber 30 in combination with the cover 28. When the treatment chamber 30 is opened, the object to be treated W is housed inside the cover 28 by the supporting member 23.


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Inventors:
OSHIMA KAZUHIKO
TERASHITA YUICHI
SHIZUKUISHI MOMOKO
SHIDE HIDEO
YOSHIHARA KOSUKE
Application Number:
JP2004295602A
Publication Date:
June 09, 2005
Filing Date:
October 08, 2004
Export Citation:
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Assignee:
TOKYO ELECTRON LTD
International Classes:
H01L21/027; (IPC1-7): H01L21/027
Domestic Patent References:
JP2002175975A2002-06-21
JP2002353110A2002-12-06
JPH10321493A1998-12-04
JP2001148379A2001-05-29
Attorney, Agent or Firm:
Kinoshita Shigeru



 
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