Title:
HEAT TREATMENT APPARATUS AND HEAT TREATMENT METHOD
Document Type and Number:
Japanese Patent JP2011173075
Kind Code:
A
Abstract:
To provide a heat treatment apparatus and a heat treatment method efficiently removing PCB (polychlorinated biphenyl) attached to a treating object.
The heat treatment apparatus has a heat treatment furnace 20 having a heater 40 and heat-treating the treating object 18 to which polychlorinated biphenyl is attached, a front chamber 22 and a rear chamber 24 provided in a front stage and a rear stage of the heat treatment furnace respectively, and partitioned by openable/closable doors 26, 28, 30 and 32 respectively, and a negative pressure holder 38 keeping the front chamber and the rear chamber at a negative pressure.
Inventors:
SASAKI SHIZUO
AOYAMA HARUNORI
FUJISHIMA KATSUHIKO
AOYAMA HARUNORI
FUJISHIMA KATSUHIKO
Application Number:
JP2010039769A
Publication Date:
September 08, 2011
Filing Date:
February 25, 2010
Export Citation:
Assignee:
NICHIYO ENGINEERING KK
International Classes:
B09B3/00; A62D3/40; F23G7/00; F27B9/02; F27B9/30; F27D17/00; A62D101/22
Domestic Patent References:
| JP2001137824A | 2001-05-22 | |||
| JPH11138132A | 1999-05-25 | |||
| JP2000084519A | 2000-03-28 | |||
| JP2010142757A | 2010-07-01 |
Attorney, Agent or Firm:
Yoshito Kitano
Haruhiko Mimura
Tomoki Kubota
Haruhiko Mimura
Tomoki Kubota