To provide a heat treatment apparatus and a heat treatment method for heating and drying a coating film on a substrate while suppressing film thickness irregularity.
The heat treatment apparatus includes a heat treatment stage 2 for floating a substrate W, and a transfer device 3 for carrying the substrate W in the heat treatment stage 2 and carrying out the substrate W therefrom. The heat treatment stage 2 includes a diaphragm section 20 for floating the substrate W by supersonic vibration, and a supersonic wave generation section 40 for giving a supersonic vibration to the diaphragm section 20, and heating operation for heating the substrate W while floating on the heat treatment stage 2, carry-in operation for carrying the substrate W, while floating, in the heat treatment stage 2 by the transfer device 3, and carry-out operation for carrying out the substrate W, while floating, from the heat treatment stage 2 by the transfer device 3 are carried out. The supersonic wave generation section 40 controls the diaphragm section 20 so that the floating amount of the substrate W during the heating operation is smaller than that during the carry-in operation and carry-out operation.
OKAMOTO SHUNICHI
MORI TOSHIHIRO
UCHIGATA TOMOO
HAMAKAWA KENJI
MIYAJIMA YUYA
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