HEAT TREATMENT APPARATUS OF MULTISTAGE HEATING PLATE SYSTEM

Japanese Patent JP3851784

B2

PROBLEM TO BE SOLVED: To improve thermal performance by downsizing a heat treatment apparatus for glass substrates, etc.
SOLUTION: The heat treatment apparatus is composed of heating plates 1 spaced by intervals c and supported by spacer pins 2 and a support beam 11, workpieces W supported by support tubes 13 above the heating plates 1, rotational elevator shafts 3 whose rotation and vertical movement are controlled by rotational and elevator systems 5 and 6, a respectively, pawl members 4 fixed to the shaft 3 corresponding to the intervals c which are formed so that either of them enters the interval c and brackets 15 positioned below the support tubes 13 and fixed to the heating plates 1 to support them by ascending or descending. The shafts 3 are successively rotated and moved vertically to insert the pawl members 4 inside the intervals c. This raises the heating plates positioned above the intervals, opens the intervals c to enlarge the spaces above and beneath the workpieces W and therefore enables removal and insertion of the workpieces W. The interval at a normal state is minimized to improve the thermal performance and to downsize the device.

WO/1985/002837	FABRICATION OF HIGH-SILICA GLASS ARTICLE
JP2020105061	MANUFACTURING METHOD FOR POROUS GLASS MEMBER
WO/2001/034530	GERMANIUM SILICON OXYNITRIDE HIGH INDEX FILMS FOR PLANAR WAVEGUIDES

Tsutomu Hirata

JP2001069405A

November 29, 2006

March 12, 2001

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ESPEC CORPORATION

C03B32/00; C03B25/02; C03B27/012; F27D5/00; (IPC1-7): C03B32/00; F27D5/00

JP3066387U
JP5203365A

Kenji Kageyama

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