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Title:
HEAT TREATMENT APPARATUS AND TEMPERATURE MEASURING METHOD OF HEAT TREATMENT APPARATUS
Document Type and Number:
Japanese Patent JP2012172871
Kind Code:
A
Abstract:

To provide a heat treatment apparatus, with which installing cost of a thermocouple is reduced, and a signal from the thermocouple is not required to be calibrated.

An in-furnace temperature sensor of a reference area A1 has a first thermocouple 81 comprising an R thermocouple or an S thermocouple, and a second thermocouple 82 comprising another thermocouple; and in-furnace temperature sensors of other regions A2 to A10 has the second thermocouple 82. The second thermocouple 82 of the reference region A1 and the second thermocouples 82 of the other regions A2 to A10 are connected to an electromotive force difference circuit 83. A temperature difference between the reference region A1 and the other regions A2 to A10 is determined by the electromotive force difference circuit 83; a temperature in the reference region A1 is determined by the first thermocouple 81 of the reference region A1; and a temperature in each other region A2 to A10 is determined by a temperature difference determined by the temperature in the reference region A1 and the temperature difference determined in the electromotive force difference circuit 83.


Inventors:
SUGANO SOICHI
Application Number:
JP2011033419A
Publication Date:
September 10, 2012
Filing Date:
February 18, 2011
Export Citation:
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Assignee:
TOKYO ELECTRON LTD
International Classes:
F27B5/18; F27D21/00; H01L21/31
Domestic Patent References:
JP2012109520A2012-06-07
JPS63121431U1988-08-05
JP2002110556A2002-04-12
JP2003035607A2003-02-07
JP2006093377A2006-04-06
JPH11219888A1999-08-10
JPH02194410A1990-08-01
Attorney, Agent or Firm:
Hirohito Katsunuma
Hiroyuki Nagai
Katsuomi Isogai
Satoshi Nazuka
Junpei Okada
Hideyuki Mori
Yukihiro Hotta