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Patent Searching and Data


Title:
HEAT TREATMENT APPARATUS
Document Type and Number:
Japanese Patent JP2011187768
Kind Code:
A
Abstract:

To provide a heat treatment apparatus that reduces sticking of foreign matter on a substrate to improve productivity.

The heat treatment apparatus includes a heating section which heats the substrate stored in a storage chamber, a first temperature detection section which detects temperature nearby the heating section, a second temperature detection section which is located closer to the substrate than the first temperature detection section and detects temperature nearby the substrate, and a control section which performs heating control over the heating section based upon the detected temperature of the first temperature detection section for a predetermined time after the substrate is put in a furnace.


Inventors:
NAKAMURA IWAO
IZUMI MANABU
Application Number:
JP2010052599A
Publication Date:
September 22, 2011
Filing Date:
March 10, 2010
Export Citation:
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Assignee:
HITACHI INT ELECTRIC INC
International Classes:
H01L21/265; F27D19/00; F27D21/00; H01L21/22; H01L21/31
Attorney, Agent or Firm:
Hideo Akazawa
Mitsue Haba