HEAT TREATMENT APPARATUS

Japanese Patent JP2014022537

A

To provide a heat treatment apparatus for heating and drying a coating film on a substrate while suppressing film thickness irregularity.

The heat treatment apparatus 1 includes a levitation transfer path 2 for floating a substrate W, and a transfer device 3 for transferring the substrate W, floating on the levitation transfer path 2, in a specific direction. The levitation transfer path 2 performs heat treatment of the substrate W while floating the substrate W, and the transfer device 3 transfers the substrate W on the levitation transfer path 2. The levitation transfer path 2 has a gas floating region 4 for floating the substrate W by a gas jetted, and a supersonic vibration floating region 5 for floating the substrate W by supersonic vibration. The transfer device 3 transfers the substrates W sequentially to the gas floating region 4 and the supersonic vibration floating region 5 arranged in a specific direction. The surfaces of the gas floating region 4 and the supersonic vibration floating region 5 facing the substrate W are larger than the substrate W, and the substrate W is carried into the gas floating region 4 at first.

OKUDA DAISUKE
OKAMOTO SHUNICHI
MORI TOSHIHIRO
UCHIGATA TOMOO
HAMAKAWA KENJI
MIYAJIMA YUYA

JP2012159325A

February 03, 2014

July 18, 2012

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TORAY ENG CO LTD

H01L21/027; F26B15/12; H01L21/677; B05C9/14; B05C13/02

JPH0724415A	1995-01-27
JP2006205064A	2006-08-10
JP2012091122A	2012-05-17
JP2008016543A	2008-01-24
JP2011124342A	2011-06-23
JP2012057854A	2012-03-22
JPH0724415A	1995-01-27
JP2006205064A	2006-08-10
JP2012091122A	2012-05-17
JP2008016543A	2008-01-24

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