Title:
HEAT TREATMENT DEVICE AND METHOD THEREFOR
Document Type and Number:
Japanese Patent JP3940831
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a heat treatment device to prevent vibration of a material to be treated during heat treatment, reduce incurring of a heat loss, reduce size, and perform heat treatment with high precision irrespective of the shape of the material to be treated.
SOLUTION: The heat treatment 1 is provided with heat treating plate 4 on which a material P to be treated is placed. Two flow passages 4a and 10 are formed in the heat treating plate 4. Different heating mediums are caused to flow through one flow passage 4a and the other flow passage 10, and heat treatment is applied on the material P to be treated placed on the heat treating plate 4.
Inventors:
Shohei Tsuji
Atsushi Hiura
Atsushi Hiura
Application Number:
JP2000340560A
Publication Date:
July 04, 2007
Filing Date:
November 08, 2000
Export Citation:
Assignee:
Koyo Thermo System Co., Ltd.
International Classes:
B65G49/07; F27D3/12; F27B5/14; H01L21/677; H01L21/68; H05K3/34; (IPC1-7): F27D3/12; B65G49/07; F27B5/14; H01L21/68; //H05K3/34
Domestic Patent References:
| JP2002009079A |
Attorney, Agent or Firm:
Einosuke Kishimoto
Moriichi Kishimoto
Akira Watanabe
Norihiko Hibi
Kiyosue Yasuko
Moriichi Kishimoto
Akira Watanabe
Norihiko Hibi
Kiyosue Yasuko
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