Title:
HEAT TREATMENT DEVICE
Document Type and Number:
Japanese Patent JP2001168012
Kind Code:
A
Abstract:
To reduce the quantity of dry air to be used for lowering a temperature.
Concerning the heat treatment device for applying a heat treatment to a wafer W, this device is provided with a hot plate 1 for placing the wafer W, heating element 1 for heating the hot plate 1, cooling jacket 5 which has an injection port 7 for injecting a gas for cooling and for cooling the hot plate 1, gas piping 13 for communicating the injection port 7 of the cooling jacket 5 and a cooling gas feeding source 15, and air cooler 20 provided on the gas piping 13 for controlling the temperature of the gas for cooling (dry air), which flows in the gas piping 13.
Inventors:
MATSUSHITA MASANAO
Application Number:
JP35078499A
Publication Date:
June 22, 2001
Filing Date:
December 09, 1999
Export Citation:
Assignee:
DAINIPPON SCREEN MFG
International Classes:
G03F7/30; F27B3/20; F27B3/24; F27B17/00; H01L21/027; (IPC1-7): H01L21/027; F27B3/20; F27B17/00; G03F7/30