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Patent Searching and Data


Title:
HEAT TREATMENT DEVICE
Document Type and Number:
Japanese Patent JP2003302167
Kind Code:
A
Abstract:

To provide a heating board type heat treatment device with small occupying layout space and excellent heat efficiency, and capable of increasing the number of loaded works.

The heat treatment device comprises front and rear fixed board parts 21 and 22, front and rear lifting board parts 31 and 32, a vertical moving support part 4, even-step and odd-step lifting parts 51 and 52, front and rear lifting parts 61 and 62, a work carry-in device 7, a pipe return device 8, a work carry-out device 9, a lowering device 10 and the like. A number of works can be treated even if there is a heating board by carrying a work in and mounting the work on the vertical moving support part 4 in combination with a support pipe, repeating the motions of vertical movement to one side, rising on one end side, vertical movement to the other side and rising on the other end side to progress the support pipe on which the work is mounted, separating the work and the pipe at the time of carrying out, and carrying out the work and returning the support pipe to the carry-in side. Accordingly, the device's occupying space can be reduced, the heat efficiency can be improved, and further, the number of works to be processed can be freely increased at the fixed board parts.


Inventors:
HIRATA TSUTOMU
Application Number:
JP2002103490A
Publication Date:
October 24, 2003
Filing Date:
April 05, 2002
Export Citation:
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Assignee:
ESPEC CORP
International Classes:
G02F1/13; B65G25/00; C03B35/20; F27B9/02; F27B9/26; F27B9/36; G02F1/1333; (IPC1-7): F27B9/02; B65G25/00; C03B35/20; F27B9/26; F27B9/36; G02F1/13
Attorney, Agent or Firm:
Kenji Kageyama