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Patent Searching and Data


Title:
HEAT TREATMENT DEVICE
Document Type and Number:
Japanese Patent JP2006010268
Kind Code:
A
Abstract:

To provide a heat treatment device capable of suppressing produced gas generated following heat treatment of an object to be heated, and leakage of the so-called sublimates generated by cooling the produced gas.

The heat treatment device has a conversion part 6 for taking in and out a substrate from a heat treatment chamber 12. Air nozzles 65 and 66 capable of jetting clean air are arranged above and below a through hole 44c of a shielding plate 44 composing a boundary portion of the conversion part 6 and the heat treatment chamber 12. When air is jetted from the air nozzles 65 and 66, an air curtain C is formed in the boundary portion of the conversion part 6 and the heat treatment chamber 12. Consequently, leakage of the produced gas and the sublimates generated in the heat treatment chamber 12 to the outside of the heat treatment device 1 is prevented even when the conversion part 6 is opened and closed.


Inventors:
YASAKA MASAO
Application Number:
JP2004190751A
Publication Date:
January 12, 2006
Filing Date:
June 29, 2004
Export Citation:
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Assignee:
ESPEC CORP
International Classes:
F27B17/00; F27D7/06; G09F9/00
Attorney, Agent or Firm:
Takashi Fujita