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Title:
HEAT TREATMENT DEVICE
Document Type and Number:
Japanese Patent JP2015210065
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To reduce the size of a device as a whole, and to decrease a power consumption amount.SOLUTION: A heat treatment device which performs heat treatment to an object 1 placed in a device main body 10 comprises: a cover body 30 which positions the object 1 in a substantially-sealed space by being arranged in a form for covering the surroundings of the object 1; an induction heating coil 40 which is arranged in the device main body 10 in a state that a heat insulation plate 11 is interposed between the object 1 and itself, heats a heat generation body 20 for placing the object 1 by induction heating when being driven, and indirectly heats the object 1; atmosphere adjusting means which supplies an inert gas to a space formed of the cover body 30, and adjusts an atmosphere of the space; and a control part 70 which performs the heating treatment of the object 1 by driving the induction heating coil 40 when a heat treatment command is imparted, and on the other hand, when the heating treatment of the object 1 is performed, stops the drive of the induction heating coil 40, increases the supply of the inert gas by the atmosphere adjusting means, and performs the cooling treatment of the object 1.

Inventors:
TAKEUCHI MASAKI
NAKAHARA HIROAKI
Application Number:
JP2014093995A
Publication Date:
November 24, 2015
Filing Date:
April 30, 2014
Export Citation:
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Assignee:
FUJI ELECTRIC CO LTD
International Classes:
F27D11/06; B23K1/002; B23K1/008; B23K3/04; B23K31/02; F27B3/08; F27B3/20; F27B3/22; F27B3/24; F27B3/28; F27D7/06; F27D9/00
Domestic Patent References:
JP2013201292A2013-10-03
JP2013201292A2013-10-03
JP2012191158A2012-10-04
JP2003306772A2003-10-31
JPH1027759A1998-01-27
JP2003257956A2003-09-12
JP2003272809A2003-09-26
JP2012191158A2012-10-04
JP2003306772A2003-10-31
JPH1027759A1998-01-27
JP2003257956A2003-09-12
JP2003272809A2003-09-26
Attorney, Agent or Firm:
酒井 宏明



 
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