Title:
HEAT TREATMENT DEVICE
Document Type and Number:
Japanese Patent JPH06310448
Kind Code:
A
Abstract:
PURPOSE: To uniformly and accurately heat the whole subject to be heat-treated such as a semiconductor wafer and accurately control the heat treatment temperature.
CONSTITUTION: A heat treatment device 10 is provided with a heating means 13, which heats a semiconductor wafer W supported by a support 12 in a process container 11 so as to perform the prescribed heat treatment, and a cooling means 14, which cools the semiconductor wafer W processed by the heating means 13. A heating plate 15 is provided at a prescribed distance from the semiconductor wafer W supported by the support 12 in the process container 11 and the semiconductor wafer W is heated through the heating plate 15.
Inventors:
IMAHASHI KAZUNARI
Application Number:
JP11915693A
Publication Date:
November 04, 1994
Filing Date:
April 21, 1993
Export Citation:
Assignee:
TOKYO ELECTRON LTD
International Classes:
H01L21/205; C30B31/12; H01L21/22; H01L21/26; H01L21/31; H01L21/324; (IPC1-7): H01L21/22; H01L21/205; H01L21/31; H01L21/324
Attorney, Agent or Firm:
Hajime Ohara