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Patent Searching and Data


Title:
HEAT TREATMENT EQUIPMENT
Document Type and Number:
Japanese Patent JP2006078019
Kind Code:
A
Abstract:

To provide a heat treatment equipment capable of shortening the distance to make illumination distribution become broad by making illumination distribution in a surface of a panel-shape object to be heated such as a semi-conductor wafer and the like be even in its radial direction.

For a sheet-shape heating device 1 provided with a heating circle 4 including a lamp and a resistance heater and the like on concentric circular shape, the panel-shape object 5 to be heated is positioned to face with it and rotate. A rotation center C2 of the panel-shape object 5 to be heated is relatively shifted from a center C1 of an arc of a heating source circle group of the sheet-shape heating device and decentered so that temperature difference in the surface of the panel-shape object 5 to be heated is mitigated in a process of the panel-shape object 5 to be heated passing through high and low zones at different temperatures.


Inventors:
SUZUKI MASAYUKI
ISHIZU HIDEO
Application Number:
JP2004260105A
Publication Date:
March 23, 2006
Filing Date:
September 07, 2004
Export Citation:
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Assignee:
KOKUSAI ELECTRIC SEMICONDUCTOR
International Classes:
F27B5/14; F27D5/00; F27D11/00; H01L21/26
Attorney, Agent or Firm:
Toru Yui
Aniya Setsuo
Hitoshi Kiyono