Title:
HEAT TREATMENT EQUIPMENT
Document Type and Number:
Japanese Patent JP3966664
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide heat treatment equipment which is capable of thermally and uniformly treating a substrate with a lid kept nearly uniform in temperature distribution.
SOLUTION: A heat treatment equipment which heat-treats a substrate W at a prescribed temperature is equipped with a heating plate 51 where the substrate W is mounted or provided proximate, a lid 62 which covers the surface of the heating plate 51 to form a processing chamber S during the heat treatment of the substrate W, and a heat pipe 65 which is formed by filling the inner space 62c of the lid 62 with hydraulic fluid 66.
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| JPH02166391 | HEAT PIPE |
Inventors:
Eiichi Shirakawa
Application Number:
JP2000047512A
Publication Date:
August 29, 2007
Filing Date:
February 24, 2000
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
F28D15/02; H01L21/027; (IPC1-7): H01L21/027; F28D15/02
Domestic Patent References:
| JP11204417A | ||||
| JP6061184A | ||||
| JP10189429A | ||||
| JP6349722A | ||||
| JP6275512A | ||||
| JP4127516A |
Attorney, Agent or Firm:
Hiroshi Takayama